印制板镀超厚金工艺技术研究

The study of electroplating super thick gold technology in PCB manufacture

印制板产业传统的镀金工艺厚度一般为0~0.8μm;而由于航天军工某些特殊要求,镀金厚度必须达到0.8μm^2.0μm,已经属于超厚金范畴。本文从物料遴选、工艺参数、流程设计等方面进行研究分析,最终实现超厚金0.8~2.0μm工艺从样品研究到最终的批量生产。

The traditional PCB electroplated gold＇s thickness ranges from 0 to 0.8μm, but in some special industry such as aerospace explore field electroplated gold thickness should be between 0.8-2.0μm which is named as the super thick gold. To improve the ability of electroplating thick gold, this paper did the research from raw material selecting, parameters study and procedure design. Finally we success in producing 0.8 to 2.0μm electroplated gold and push it to the market.