HF酸蚀对氧化锆陶瓷与树脂短期粘接性能的影响

Short term bonding improvement of zirconia to resin via HF etching

目的评价常温下使用HF对Y-TZP陶瓷进行蚀刻提高其与树脂短期粘接强度的效果。方法制作Y-TZP瓷片48枚,分别进行氧化铝喷砂、室温下以40%HF酸蚀90 min和室温下以40%HF酸在超声环境下振荡15 min的方式进行表面粗化,随后在处理表面分别使用2种通用型粘接剂,制作树脂粘接试件,测试24 h水储后的剪切粘接强度。原子力显微镜测试3种粗化方式获得的表面粗糙度,并以扫描电镜观察表明微观形态。结果 2种酸蚀方法获得的表面粗糙度和粘接强度较喷砂处理显著提高。结论室温下以40%HF酸蚀可以取代氧化铝喷砂作为粗化Y-TZP陶瓷的方法。

Objective To evaluate the effect of HF etching at room temperature on instant bond strength of Y-TZP to resin. Methods48 Y-TZP plates were prepared and assigned into 6 groups according to different surface treatments,including alumina sandblasting,90 min 40% HF etching,15 min ultrasonic 40% HF etching,followed by application of any one of two universal adhesives. Bonded specimens were prepared and received shear bond strength testing after 24 h water storage. The surface roughness and microcosmic morphology of the Y-TZP surfaces receiving any one of the three different roughened methods were evaluated by an atomic force microscope（ AFM） and a scanning electron microscope（ SEM） respectively. Results HF etching created larger surface roughness and higher shear bond strength than alumina sandblasting. Conclusion Etching with 40% HF at room temperature can be an alternative to alumina sandblasting for resin bonding improvement of Y-TZP.