热壁CVD制备铂薄膜的沉积室内壁材料选择研究

Selection of Deposition Chamber Materials during the Hot Wall CVD Preparation of Platinum Films

选择合适的沉积室内壁材料是热壁化学气相沉积制备Pt薄膜过程中降低前驱体在沉积室内壁上大量消耗,进而保证沉积室内Pt前驱体分压的关键。本研究对比了Pt在镍基高温合金,备选沉积室内壁材料——有氧化层的Cu以及紫铜表面的沉积的难易程度,发现在有氧化层的Cu的表面Pt薄膜很难沉积,因此当镍基高温合金为沉积基体时有氧化层的Cu可以作为热壁CVD的沉积室内壁衬底材料,但是只能一次性使用。

Selecting appropriate wall material is the key to reduce the consumption of precursor in the hot wall chemical vapor deposition process that is used to prepare platinum films so that the partial press of precursor could be maintained. In this paper, the ease of Pt films deposition was compared. The compared substrates were nickel-based superalloy, copper with oxide layer for the candidate of deposition chamber material and pure copper. The result shows that the copper with oxide layer is the hardest deposited in these experiments. Although the copper with oxide layer could be used as the substrate material in hot wall CVD, it can be used only one time.