摘要
加入无机填料是降低胶黏剂和复合材料热膨胀的常用方法,不同无机填料对降低膨胀系数有着不同的作用机理和效果,树脂基体的不同也会影响热膨胀行为。主要介绍了近些年来氧化铝(Al2O3)、氮化硼(BN)、二氧化硅(Si O)等无机填料在环2氧树脂胶黏剂和复合材料领用的应用,包括不同填料对于材料体系热膨胀行为和其它性能的影响。
It is a commonly used method to reduce thermal expansion of adhesives and composites by adding inorganic fillers. Different fillers have different mechanism and effect on reducing thermal expansion. The application of Al2O3, BN, SiO2 and other inorganic fillers in epoxy adhesives and its composites are introduced in this paper, including the influence of different fillers on the thermal expansion properties and other properties.
出处
《化学与粘合》
CAS
2016年第2期140-142,共3页
Chemistry and Adhesion
关键词
无机填料
胶黏剂
复合材料
Inorganic fibers
adhesives
composites
