摘要
采用润湿平衡法,选用商用水洗钎剂研究了Sn-2.5Ag-0.7Cu-0.1RE-x Ni钎料合金在Cu引线和Cu基板上的润湿特性。结果表明,当Ni添加量为0.05%-0.1%时,Sn-2.5Ag-0.7Cu-0.1RE钎料合金中在Cu引线上具有较短的润湿时间,较小的润湿角,较大的润湿力;在Cu基板上具有较小的润湿角和较大的铺展面积;焊点界面区Cu6Sn5厚度小而平整;其润湿特性满足现代表面组装技术对无铅钎料润湿性能的要求。
The wetting properties of Sn-2. 5Ag-0. 7Cu-0. 1RE-x Ni lead-free solder alloy on the surface of copper wire and copper base plate by adopting commercial water-soluble flux were investigated by means of wetting balance methods. The results show that Sn-2. 5Ag-0. 7Cu-0. 1RE solder alloy has better wetting properties and the Cu6Sn5 thickness of its solder joints interface is thin and flat with the addition of0. 05-0. 1% Ni,i. e. it has higher wetting force,smaller wetting angle and shorter wetting time on the surface of 0. 6 × 30 mm copper wire and smaller wetting angle and larger spreading area. The wetting property can meet the standard to the lead-free solders of surface mount technology industry.
出处
《材料热处理学报》
EI
CAS
CSCD
北大核心
2016年第3期24-29,共6页
Transactions of Materials and Heat Treatment
基金
国家自然科学基金重点项目(U1502274)
河南省创新型科技团队(C20150014)
