基于LS-DYNA的第一键合点碰撞过程分析

Frist Bonding Impact Process Analysis Based on LS-DYNA

运用ANSYS/LS-DYNA有限元软件,模拟瓷嘴匀速下降直至碰撞芯片的过程。利用测振仪得到瓷嘴接近焊盘的速度,通过集中质量单元表述键合头惯量参数来简化模型,分析在一定接近速度和集中质量条件下的键合碰撞过程,得到碰撞过程中焊球与焊盘的应力应变分布及碰撞力变化曲线。最终得到的碰撞力峰值与实际碰撞力相近,证明了有限元分析的有效性,同时为焊盘结构设计提供了一定的理论参考。

The analysis of first bonding process when capillary declined till contacting the chip was performed by LS-DYNA.The approach velocity was obtained by vibration measurer and the inertia parameter of bonding head was substituted by lumped mass.The simplified model with constant velocity and lumped mass was analysed to get the stress and strain distribution graphs and the impact force curve.The results show that the peak value of impact force is close to the actual one.The finite element analysis is effective and can provide some theoretical references for bonding pad structure design.