摘要
针对目前工业领域对多层电路板缺陷检测高效高精度的要求,设计了一种基于分层层析成像技术的多层电路板缺陷自动检测系统,并对电路板中常见的缺陷类型进行分析和研究。针对不同的缺陷类型提出了不同的数学形态学识别方法,并对缺陷类型进行了相应的标记,解决了传统DR(Digital Radiography)和传统X射线CT(Computed Tomography)技术对多层电路板无法进行内部电路分析的问题。将分层层析成像技术应用于多层电路板的缺陷检测,对检测系统性能的改进具有重要的意义。
The defect inspection system based on computer tomography for multilayer printed circuit boards（MPCBs）was designed to meet high efficiency and high precision requirement in industry field.The defect types of PCB were discussed.The mathematical morphology with pattern recognition was applied to marking the positions and classes of the defects,which overcome the shortcoming of getting a full and accurate circuit image of every layer and the position of the defects difficultly by the DR（digital radiography）method and traditional computed tomography（CT）scanning methods.It was noteworthy that the computer laminography applied to defect detection of multilayer printed circuit boards could considerably improve the performance of the inspection system.
出处
《机械工程与自动化》
2016年第2期145-146,151,共3页
Mechanical Engineering & Automation
基金
国家重大科学仪器设备开发专项(2014YQ240445)
关键词
层析成像
多层电路板
缺陷检测
数学形态学
computer laminography
multilayer printed circuit boards
defect inspection
mathematical morphology
