超薄金刚石带锯镀层均匀性研究

Study of the Uniformity of Ultra-Thin Diamond Band Saw Plating

文章通过有限元计算方法对复合电沉积制备超薄金刚石带锯过程进行了模拟计算分析,并与实验结果进行对比。结果表明:复合电沉积制备超薄金刚石带锯(d≤0.2mm)过程,超薄边引起的最高电流密度比最低电流高出3倍,并随镀层的增厚差距逐渐减小,高电流密度区的电流密度先快后慢下降,低电流密度区电流密度先慢后快增高;镀层增厚过程为顶端沉积速率先快后慢,底部沉积速率先慢后快,引起顶端与低端厚度约2倍差距;平均电流密度等效面顶部位移中间面外侧底部位于中间面内侧。最后与实验测试结果对比,模拟计算结果与实验测试结果相符。

The preparation process of ultra-thin diamond band saw by composite electrodeposition method has been simulated and analyzed through finite element calculating method and the result has been compared to the experiment result.Result shows that during the preparation process of ultra-thin diamond band saw（d≤0.2mm）by composite electrodeposition method,the highest current density caused by ultra-thin edge is 3times higher than the lowest current.As the thickness difference of the plating decrease,the current density of the high current density area decreases quickly at first and then slow down,while the current density of the low current density area increases slowly at first and then increases quickly;for the plating thickening process,deposition rate at the top is high at first and then getting low while the deposition rate at the bottom is low at first and then getting high,this leads to a 2times difference of thickness between the top and the bottom;the top of the equivalent surface of the average current density lies on the lateral of the middle surface while the bottom of it lies on the inner side of the middle surface.By contrast,the simulation result is the same as the experiment result.