工程陶瓷加工表面临界条件的研究

Study on the Surface Critical Conditions of Engineering Ceramics

研究了工程陶瓷磨削加工时的未变形切屑厚度模型,陶瓷加工时材料去除形式分为延性域去除、延脆性域去除和脆性域去除等3种,并通过引进延性域系数η_0、延脆性域系数η_1,建立了延脆性域2个临界磨削深度模型。利用微晶玻璃陶瓷展开磨削试验,得到了工程陶瓷加工表面粗糙度与磨削速度、磨削深度、工件进给速度及未变形切屑厚度的关系,进而得出工程陶瓷加工表面临界条件的规律,并给出了所提出的相关系数和微晶玻璃陶瓷延脆性域2个临界磨削深度,为工程陶瓷加工表面成形机理的研究提供了一定的参考。

The undeformed chip thickness model of engineering ceramics is improved, and it is pointed out that the re moral domains of ceramics grinding can he divided into the ductile region, the ductile brittle region, and the brittle region. The model of the two critical grinding depth is established by introducing ductile regime coefficient η0 and the ductile brittle regime coefficient η1. The relationship among surface roughness of engineering ceramics and grinding speed, grinding depth, feed rate of the workpiece, undeformed chip thickness is obtained hy analysing the grinding experimental results of glass ce ramics. Then the critical conditions of engineering ceramics are acquired. Finally, the correlative coefficients and two critical grinding depth of ductile-brittle regime of glass ceramics are given. The results offer some reference for the research on the surface forming mechanism of engineering ceramics.