摘要
利用FLUENT软件对通过微小喷嘴通道流入一种新型清洗釜内的超临界二氧化碳进行了数值模拟,根据模拟结果,计算和分析了清洗釜内被清洗硅晶片的表面所受到的剪切作用力。结果表明,超临界二氧化碳流体在新型清洗釜内的流动状况良好,硅晶片表面能受到超临界二氧化碳流体一定的冲刷,有良好的清洗效果。因此,数值模拟结果能给予新型清洗釜的设计以一定的理论依据,为今后超临界二氧化碳绿色清洗技术的优化提供一种理论分析方法。
Numerical simulation supercritical carbon dioxide flow, which was spurted from a micro nozzle in a new cleaning kettle and was inpoured into it, was made by using FLUENT software. The shear force acting on the surface of the silicon wafer embedded in the new cleaning kettle was compu- ted and analyzed. The results show that the supercritical carbon dioxide fluid flows well within the new cleaning kettle, and the silicon wafer surface can be scoured by the supercritical carbon dioxide fluid in the kettle,and hence,the new kettle has a better cleaning effect. So, the numerical simulation re- sults can give a certain theory guide for the technological design of the new clean kettle, and can pro- vide a beneficial theoretical analysis method for the optimizing of supercritical carbon dioxide green cleaning technology in the future.
出处
《清洗世界》
CAS
2016年第3期24-28,45,共6页
Cleaning World
基金
中央高校基本科研业务费项目
"绿色清洗技术中超临界CO2的特性研究(2014MS110)"
关键词
绿色清洗技术
超临界二氧化碳
清洗釜
硅晶片清洗
数值模拟
green cleaning technology
supercritical carbon dioxide
cleaning kettle
cleaning of silicon wafer
numerical simulation