摘要
发光二极管(LED)灯丝已成为研究热点,通过扫描电子显微镜(SEM)对LED倒装芯片焊接进行观察,发现锡膏焊接形成了第三相,而银胶固晶仅仅起粘结作用.采用推拉力和正向电压(@20mA)测试发现,锡膏固晶的芯片推拉力是银胶的2倍,正向电压波动范围远小于银胶固晶.对锡膏固晶的热分布进行模拟和测试,发现灯丝中间温度高,两端温度低,理论与测试数据基本吻合.结果表明,锡膏焊接固晶方法更适合制备倒装LED.
The research of LED filament has become a hot topic.Scanning electron microscope（SEM）was used to observe the different bonding performances of solder paste and silver glue between flip-chip and base.Compared with simple adhesive effect of silver glue,the chip＇s push-pull effort of the bonding point of solder paste was found to be twice higher than that of the silver glue through the push-pull and forward voltage（@20mA）test.It was also found that the range of forward voltage fluctuation of the solder paste bonding was smaller than that of the silver glue.The thermal distribution of the solder paste bonding was simulated and tested.The results showed that temperature in the middle of filament was higher than that of both ends.The theory was basically identical to the testing data.Therefore,solder paste welding provides an alternative bonding solution for flip-chip LED.
出处
《上海应用技术学院学报（自然科学版）》
2016年第1期79-82,共4页
Journal of Shanghai Institute of Technology: Natural Science
基金
国家自然科学基金青年基金资助项目(51302171)
上海市学科能力建设资助项目(14500503300)
上海市联盟计划资助项目(LM201318)
上海市产学研合作项目(沪CXY-2013-61)
上海应用技术学院引进人才基金资助项目(YJ2014-04)
关键词
发光二极管灯丝
倒装芯片
推拉力测试
锡膏
固晶
银胶
light emitting diodes（LED）filament
flip-chip
push-pull test
solder paste
bonding
silver glue
