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半固态搅拌摩擦焊温度场分析及组织验证 被引量:1

Temperature Analysis and Microstructure Verification of Semisolid Friction Stir Welding
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摘要 为避免由材料流动不足而导致的焊接缺陷以及降低焊接过程中的作用力,提出了半固态搅拌摩擦焊.本文以2024-T3铝合金为研究对象,进行了焊接过程中温度及显微组织分析.温度的模拟及测量结果表明:当搅拌头的旋转速度为1 600r·min^(-1)、焊接速度为150mm/min时,稳态时焊核区的温度峰值达到了518℃,超过了焊材的固相线.空冷条件下常规搅拌摩擦焊与水冷条件下的半固态搅拌摩擦焊焊核区的显微组织对比结果表明,利用搅拌头摩擦产热的方法可使搅拌区呈现液态金属母液中均匀悬浮着近似球形晶粒的半固态组织. In order to avoid welding defects resulting from the insufficient material flow and reduce the force during the welding process,semisolid friction stir welding(SSFSW)was put forward.Choosing 2024-T3 Al alloy as research object,the temperature and the microstructure were investigated.The results of temperature by numerical simulation and experiment show that at the rotational velocity of 1 600r·min-1 and the welding speed of 150 mm/min,the peak temperature of materials in weld reaches 518 ℃ and excels the maximum temperature in solid state.Compared with the microstructure in weld zone of conventional friction stir welding joint under air cooling,the results of SSFSW joint under the water cooling show that the microstructure in weld zone is semisolid in which the grains tend to be globule and suspend in liquid.
出处 《北京理工大学学报》 EI CAS CSCD 北大核心 2016年第2期209-214,共6页 Transactions of Beijing Institute of Technology
基金 国家自然科学基金资助项目(51204111) 辽宁省自然科学基金资助项目(2013024004 2014024008) 辽宁省科技厅资助项目(2013222007)
关键词 半固态搅拌摩擦焊 2024-T3铝合金 温度峰值 数值模拟 半固态组织 semisolid friction stir welding 2024-T3 Al alloy peak temperature numerical simulation semisolid microstructure
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