基于仿真与试验的可变型孔立式复合大豆种盘参数优化

Parameter optimization of vertical compound soybean plate with variable hole based on the simulation and experiment

为提高立式排种器对种子尺寸适应性，增强机械式精密排种器市场竞争力，研究一种型孔径可变的复式种盘，并对其参数优化。设计由充种勺轮、导种轮、护种板和调节挡板组成的可变型孔立式复合种盘，只需定量改变调节挡板的调节间隙即可播种不同尺寸大豆种子。通过EDEM仿真及试验，优化得出该复合种盘型孔特征参数最优值，仿真优化得出种勺倾角θ的最优参数值为30°，种子尺寸范围4．5～6．0、6．0～8．0、8．0～10．5和10．5～13．0mm时，对应的调节间隙d分别为0、2．5、3和5mm。优化参数后的种盘经样机试验具有良好作业性能与种子适应性，可为该项技术产品转化设计奠定基础。

In order to improve the adaptation to seed size of the vertical plate, and enhance market competitiveness of the mechanical seed-metering device, a compound plate with variable hole was researched, and the parameters of the hole was optimized. The vertical compound plate with variable hole constituted by filling spoon, guide wheel, seed-shielding plate and adjust baffle. The objective of sowing with different sizes of soybean seeds was implemented only by quantitatively changing adjusting depth of adjust baffle. Optimized through the software EDEM virtual simulation, get the result that the optimal parameter value for the angle of seed spoon θ was 30°, when the seed size range ware 4.5-6.0, 6.0-8.0, 8.0-10.5, 10.5-13.0 mm, regulating clearances d ware 0, 2.5, 3, 5 mm respectively. The prototype was indicated that seed-metering device with optimum parameters had good operating performance and seed adaptability.