摘要
基于CSMC0.5μmBCD工艺,设计了一种应用于片上系统(SOC)芯片的低温漂高电源抑制的带隙基准电路.采用一种带有负反馈环路调整型的电压预调整电路,并且将基准电压形成于负反馈环路,基准电路的电源抑制特性得到显著提高.仿真得到的电源抑制比分别为-177.6dB@dc,-82.7dB@1MHz.此电路可以在-55~125℃范围内实现较小的温度系数,温度系数为5.76×10^(-6)/℃.
Based on a CSMC 0. 5μm BCD process, a high power supply rejection and low temperature drift bandgap voltage reference is proposed for the application of system-on-chip. By introducing a pseudo-power supply and generating a voltage reference in a negative feedback loop, the power supply rejection of the reference is improved. This voltage reference provides a PSR of --177. 6 dB at dc and -82.7 dB at 1MHz. Additionally, the temperature coefficient of this circuit achieves 5.76×10^(-6)/℃ covering a range of -55-125℃.
出处
《微电子学与计算机》
CSCD
北大核心
2016年第4期148-151,156,共5页
Microelectronics & Computer
关键词
带隙基准
高电源抑制
低温漂
片上系统
bandgap voltage reference
high power supply rejection
low temperature drift
system-on-chi