基于自动建模的射频功率放大器的互连可靠性研究

Research on the interconnect reliability of radio frequency power amplifier using automatic modeling

通过编程实现电路的自动建模及仿真,得到互连线的几何尺寸、电流密度及环境温度与AFD的关系,进而分析互连线的可靠性。从结果可知,温度升高、电流增大、尺寸减小等因素都会降低功率放大器互连线的可靠性。实际中,为了保证功率放大器的可靠性设计,在选择合适尺寸的晶体管和工作状态时,还需综合权衡输出功率、增益、效率等各方面指标。

This article realized the automatic modeling and simulation of the circuit by programming, then to do some analysis of interconnect reliability based on the relationship with interconnect geometric size, current density, environmental temperature and AFD. The results show that with the decrease of temperature, current, size, the reliability of the interconnect power amplifier is downgraded. In order to guarantee the reliability design of the power amplifier, it is necessary to choose the appropriate size and working state for transistors. It also needs to weigh various indicators such as output power, gain, efficiency meanwhile.