SUS301不锈钢端子的高速电镀

High-speed electroplating of SUS301 stainless steel connectors

SUS301不锈钢端子的高速电镀层,受镀件表面的平整度,高速冲压拉伸后的相变、形貌,槽液体系,工艺流程等影响极大。另外,由于氨基磺酸盐镀镍液体系所得镀镍层上形成胶体膜[Ni(OH)_2],随后镀金层中产生大量气泡、针孔,导致镀层硬、脆、结合力差等不良。采用无铬电解抛光与阳极电解活化前处理工艺,改善镀件表面的不良状态,并在刷镀金前对镀镍层作10%(体积分数)硫酸溶液浸渍,以中和镀镍层上的胶体膜。处理后的电镀层可通过硝酸、高温高湿、中性盐雾等例行考核。

The high-speed electroplated coating on SUS301 stainless steel connector is greatly affected by material surface flatness, phase transformation and morphology caused by stretching after high-speed stamping, plating bath composition, process flow and other factors. The colloidal Ni（OH）2 film formed on nickel coating obtained from a sulfamate bath causes hard, brittle and poor-adhered gold coating plated subsequently due to the formation of bubbles and pinholes in the gold coating. The chromium-free electropolishing and anodic electro-activation processes were employed to improve the state of material surface. The colloidal film on nickel coating is neutralized by immersing it into a 10vol% sulfuric acid solution prior to gold brush-plating. The improvements make the coatings possible to go through all severe tests, such as nitric acid test, damp heat test and neutral salt spray test.