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Ag包覆SnO2制备工艺及其性能研究 被引量:3

Research on preparation and performance of silver coating SnO_2 by electroless plating
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摘要 采用包覆工艺制备了AgSnO_2电接触材料,通过分散剂种类、球磨时间、活化剂种类等工艺参数的优化,制备了性能合格的AgSnO_2电接触材料。实验结果表明,聚乙二醇对SnO_2颗粒具有较好的分散作用,但不能完全消除SnO_2颗粒团聚;液态球磨能获得组织均匀的AgSnO_2材料,但材料的电阻率过高;活化剂Bi_2O_3和CuO的加入能有效地提高材料的致密度和降低电阻率;在加入0.25%Bi_2O_3+0.25%CuO并液态球磨4h后的试样致密度为98.2%,电阻率为2.25μΩ·cm。 Optimizing the parameters of type of dispersant,time of ball milling in liquid and type of activator,the AgSnO_2 electrical contact materials with good performance were prepared by electroless plating.The results shows that polyethylene glycol had a good effect for dispersing SnO_2 particles,but not completely eliminate the agglomeration of SnO_2 particle;ball milling in liquid could make AgSnO_2 had uniform organization,but had high electrical resistivity;activator of Bi_2O_3 and CuO could effectively improve the density and reduce the electrical resistivity of materials;the relative density and electrical resistivity of AgSnO_2 were 98.2%and 2.25μΩ·cm at ball milling in liquid of SnO_2 particle with 0.25% Bi_2O_3+0.25%CuO for 4h,respectively.
出处 《功能材料》 EI CAS CSCD 北大核心 2016年第4期187-190,共4页 Journal of Functional Materials
基金 四川省教育厅一般资助项目(14ZB0124) 西华大学重点科研基金资助项目(z1320109)
关键词 AGSNO2 电接触材料 化学镀 组织均匀性 活化剂 电阻率 AgSnO2 electrical contact materials electroless plating structure uniformity activator electrical resistivity
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