摘要
在HDI板的制作过程中,影响板子涨缩的因素有很多,其中各工序前处理磨板对板子的涨缩影响十分明显。寻找出各工序磨板对板子造成涨缩的规律,对改善HDI板层间对位效果及提升产品良率等具有十分重要意义。本文将就沉铜、线路、树脂研磨、阻焊和沉金等工序的磨板进行试验研究,得出在不同条件下,磨板对板子尺寸的变化情况,并给出相应的操作建议,供业界工作者参考。
In the HDI board production operation, there are many factors that can affect board shrinkage- stretch. The process of pretreatment of brush grinding board shrinkage-stretch effect on board is very obvious. To find out the process of brush grinding board to board caused by sizing rules, it is of great significance to improve the alignment effect of HD1 board and improve the yield of products. In this paper, the test is carried out to find the reason of shrinkage-stretch in PTH, line, resin grinding, solder resist, ENIG process, so as to draw in the size change in different conditions, and give the corresponding operation recommendations for the industry workers.
出处
《印制电路信息》
2016年第A01期16-26,共11页
Printed Circuit Information
基金
广东省2015年应用型科技研发专项资金项目(项目
关键词
前处理
磨板
涨缩
层间对位
Pretreatment
Brush Grinding
Shrinkage-Stretch
Contraposition