超薄1027基材压合缺胶的解决方法

The solution for poor resin issue in lamination with ultra thin prepreg 1027

由于近两年手机、平板等移动便携设备薄型化的发展，印制电路板制造企业和电子元器件企业不断推出轻薄、微型化产品，故HDI产品中增层基材越来越薄，目前批量用到1027基材，文章基于PCB制造端对超薄1027基材在使用过程中遇到的压合缺胶问题从设计、图形处理、铜厚、压板参数、材料等方面进行分析，以改善此类异常。

As the mobile phone, tablet and portable devices developing to thinner and thinner in the past two years, PCB board manufacturers and electronic components business have promoted light ,thin and miniaturized products constantly. Therefore, the dielectric thickness is getting thinner in HDI product, currently 1027 prepreg is being massively used. As for the poor resin issue during laminated with 1027 prepreg in manufacturing plant, this article is aimed to analyze design, pattern, copper thickness, laminating parameters and materials ,etc, and get solution to improve on such abnormalities.