可溶性阳极电镀填孔技术稳定性探讨

Stability study on the technology of soluble anode via filling plating

主要从可溶性填孔方面的电镀槽液不稳定，连续生产会出现填孔失效原因分析入手，通过对槽液的X射线光电子能谱分析以及加入我公司新型电镀稳定剂进行填孔性能方面的研究，当槽液中加入稳定剂的量大于5m1／L时，槽液可保持良好的填孔能力，且槽液能保持相当长的稳定性。

This paper mainly from the soluble fill in the aspect of the plating bath liquid is not stable, continuous production will appear in the cause of failure analysis,Through the XPS analysis of the tank liquid and the addition of our new plating stabilizer for the filling performance of the research. In this study, when the amount of stabilizer added in the bath liquid is in the 5ml/L, the liquid can be kept in good filling capacity and the groove liquid remains quite long Stable.