摘要
在当前诸多公司引进了垂直连续电镀（简称VCP）电镀线的趋势下，本课题以不同VCP实际生产线情况为研究对象，通过试验对比及生产数据搜集，发现在优化液位高度、挂架间距、夹板深度后，使用合适的底屏、边屏高度，可有效改善垂直方向板件的电力线分布均匀性，减少电镀过程“边缘效应”的影响，从而提高镀层均匀性。通过设备差异对比分析，底屏及边屏分别移动3mm和15mm，对板底位置镀铜厚度与整板平均厚度值差会有约4％的影响。经过优化底屏、边屏高度后，配合我公司（贝加尔）药水，可将整板镀铜均匀性变化率（简称COV）值由7．96％优化至3．14％，甚至更低。
Under the trend of many companies having introduced VCP electroplating lines, this paper took different actual VCP lines as research object by experimental comparison and production data collection, which tbund after optimizing the liquid height, rack spacing and plywood depth, using appropriate bottom and side screen height can effectively improve the power lines distribution uniformity in the vertical direction of the plate, reduce the impact of the electroplating process ＂edge effect＂, thus improve the uniformity of the coating. Through the comparison analysis of equipment difference： the bottom and side screen mobility of 3 mm and 15 mm respectively will affect about 4% both to the copper plate thickness in the bottom position and the average thickness of the entire plate. Optimizing the bottom and side screen height and by use of our company （Baikal） chemical, it can optimize the entire board copper COV value from 7.96% to 3.14%, or even lower.
出处
《印制电路信息》
2016年第A01期127-138,共12页
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