高厚径比微盲孔填孔空洞改善

Improvement on the Void of high aspect ratio microvia filling

文章研究了厚径比为1：1的微盲孔填孔过程中空洞产生的机理与不同电流密度对空洞产生的影响，得出使用低电流密度可解决填孔空洞问题，而且爆发期后转为高电流密度可以解决一直使用低电流密度引起的盲孔凹陷问题。另外，文章初探了通过电镀前使用加速剂溶液预浸微盲孔PCB的方法解决填孔空洞问题，并取得良好的效果。

In this paper, by studying the generating mechanism of void in production of filling process of 1：1 aspect ratio microvia and the influence on void under different current densities, it shows that void can be solved with low current density, and dimple which root in using low density during the whole filling process can be solved if change to high current density after explosion step. Another method that presoak microvia PCB in accelerator solution before electroplating was studied preliminarily to solve filling void and good results have been achieved.