摘要
超高导热陶瓷基板因其优良的导热性能已逐渐应用于PCB制造业。文章介绍了业界陶瓷基板的发展状况,并基于实际应用对其未来的发展做了探讨。
Ultrahigh heat conductivity ceramic substrate has been gradually used in PCB manufacture because of its excellent heat-conducting property. This paper gives a simple introduction about the usage and manufacture of ultrahigh heat conductivity ceramic substrate, and describes its future development base on its practical application.
出处
《印制电路信息》
2016年第A01期217-222,共6页
Printed Circuit Information
关键词
超高导热
陶瓷基板
印制电路板制造
Ultrahigh Heat Conductivity
Ceramic Substrate
PCB Manufacture