嵌铜块PCB制造工艺的研究和改善

Research and improvement on the process optimization of embedded copper coin PCB

随着高密集化电子元器件、大功率电子元件对PCB散热能力的要求越来越高，业界开始引入了埋嵌铜块PCB制造技术。利用铜块的高导热性能，将PCB使用过程中零件产生的热量快速转移到铜块上，然后通过铜块将热量散于空气中带走。嵌铜块PCB是在PCB压合完成后铣槽、金属化，然后把铜块嵌入PCB槽中。PCB与铜块通过两者之间的嵌入量紧密连接，并通过镀铜实现电气连接，使得整体散热性能好。文章从铜块设计、尺寸补偿及压合控制等方面出发，对嵌铜块PCB制作工艺进行分析及改善，提升嵌铜块PCB产品的品质和加工效率。

With the increasing demand for PCB heat dissipation to high density and high power electronic product, it begins to introduce embedded copper coin PCB technology in PCB industry. The heat generate by equipment parts will rapidly transfer to copper coin for its high thermal conductivity, and then take away to air through it also. To create embedded copper coin PCB, first, we carry out milling groove and metallizing process alter lamination, next, embed copper coin in groove which should be closely connected by embedding capacity controlling. And then it realizes electrical connection by this paper, we have analyze and improve the production coppering, finally has served heat dissipation purpose. In process of copper coin PCB, take measnres fi＇om copper coin design, dilnension compensation, lamination controlling .