高速板制作工艺探究

Research on the process of multilayer ladder board

通讯领域的高速发展以及云计算的应用，产品对信号的传输速度要求也越来越高。介质损耗为〈0．035（1MHz）的常规FR-4板材，已无法满足信号高速传输需求，介质损耗〈0．02的高速板材，将得到广泛应用。重点阐述高速板材在不同频率下，传输速度的选择，以及对高速板材加工难点——升温速率，进行试验并提出可行性的解决方案，为行业内同仁提供一个有价值的参考。

With the rapid development of the field of communication and the application of cloud computing, the speed of the transmission of the signal is also getting higher and higher. Dielectric loss is less than 0.035 （1 MHz） of the conventional FR-4 sheet, has been unable to meet the demand for high-speed transmission of the signal, the dielectric loss of 0.02 of the high-speed sheet, will be widely used. This paper describes high speed plate under different frequency, transmission speed, and the difficulties in the machining of high speed plate heating rate, test and put forward feasible solutions, which will provide a valuable reference for colleagues in the industry.