湿法缠绕用树脂体系黏度及固化动力学研究

Study on viscosity and curing kinetics of resin system for wet winding

采用旋转黏度计测试了液晶环氧树脂改性E-51树脂体系黏度,结果表明,在7h内该树脂体系黏度小于2000mPa·s,满足缠绕工艺黏度要求;用DSC法研究了该树脂体系固化动力学,T-β外推法推导出固化工艺参数,并确立固化工艺参数为75℃/2h+130℃/2h+180℃/2h,为液晶环氧树脂改性E-51树脂湿法缠绕工程化应用提供了理论依据。

The viscosity of E-51 resin system modified by LCD was tested by rotational viscometer,its viscosity less than 2000mPa·s within 7h,meeting the viscosity requirements of winding process.Curing dynamics of resin system was studied by DSC,curing process parameters was derived by T-βextrapolation,And the curing process was 75℃/2h ＋130℃/2h ＋ 180/2h,Providing engineering applications theoretical basis for E-51 resin system modified by LCD for wet winding.