摘要
针对航天及军工产品的特殊需求,我们成立专项课题研究小组,系统性研究盲孔制造工艺技术及可靠性验证方法,目前已经全面达到量产化阶段,部分含有盲孔的HDI印制板已经应用于我国国防武器装备中。
According to the special needs of aerospace and military products,the company sets up special research group,studies in system on the blind hole fabrication technology and reliability verification method.The research has fully reached the production stage.HDI PCB containing a few blind holes has been applied to our national defense weapons and equipment.
出处
《印制电路信息》
2016年第4期31-36,共6页
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