树脂塞孔工艺流程优化探讨

Discussion and process optimization of resin plugging process

在印制电路板生产过程中,树脂塞孔的孔铜因客户有相应要求,往往是先经过一次板电后,再经镀孔流程满足客户要求。主要通过实验,探究此类树脂塞孔板一次全板镀孔到客户要求树脂塞孔孔铜,塞孔后,再经板面减铜到客户要求的铜厚。

Customers usually have requirements of the copper in the hole that should be plugged by the resin.In the production,manufacturers often plate the holes after the whole panel electroplating to meet the requirements of Copper thickness.In this paper,a series of experiments have been done to research a new process：the wall copper in the hole which will meet the requirements of customers after whole panel electroplating,then plug the holes by resin,and reduce the copper thickness on the surface of the panel to meet the requirements of copper thickness.