期刊文献+

LD30铝合金与304不锈钢低温钎焊润湿性研究 被引量:1

Low-temperature brazing wettability research of LD30 aluminum alloy and 304 stainless steel
下载PDF
导出
摘要 采用LD30铝合金与304不锈钢低温钎焊工艺进行润湿性研究。通过润湿性研究对比,选用了60Sn-40Pb、Sn-3.5Ag和35Sn-40Pb-25Bi 3种适用于LD30铝合金和304不锈钢的低熔点钎料,并针对每种钎料选取与之相匹配的钎剂。分析了接头的微观组织、化合物相成分和X射线探伤。结果表明:60Sn-40Pb和35Sn-40Pb-25Bi与H3PO4组合在304不锈钢上润湿性很好;不锈钢与镀镍层铝合金钎焊试验时,60Sn-40Pb和35Sn-40Pb-25Bi与50%H3PO4+50%乙二醇组合润湿性很好;Sn-3.5Ag钎料润湿性相对较差。 LD30 aluminum alloy with 304 stainless steel using low temperature brazing was performed in the wettability research. Through wettability study contrast, three kinds of low melting point solders60Sn-40 Pb,Sn-3. 5Ag and 35Sn-40Pb-25 Bi which were suitable for LD30 aluminum alloy and 304 stainless steel were chosen,and solder flux was selected. The joint of microstructure,phase composition,X-ray inspection were analyzed. Results show that the 60Sn-40 Pb and 35Sn-40Pb-25 Bi combine with H3PO4 have good wettability on 304 stainless steel; the 60Sn-40 Pb and 35Sn-40Pb-25 Bi combine with 50% H3PO4 and 50%glycol have good wettability in the brazing experiment and the Sn-3. 5Ag has relatively poor wettability.
作者 熊欢 曲文卿
出处 《北京航空航天大学学报》 EI CAS CSCD 北大核心 2016年第3期619-624,共6页 Journal of Beijing University of Aeronautics and Astronautics
关键词 LD30铝合金 304不锈钢 润湿性 低温钎焊 钎料 LD30 aluminum alloy 304 stainless steel wettability low-temperature brazing solder
  • 相关文献

参考文献15

  • 1向艳超,侯增祺,张加迅.环路热管技术(LHP)的发展现状[J].工程热物理学报,2004,25(4):682-684. 被引量:24
  • 2曲文卿.铝合金同其它金属连接技术研究[D].北京:北京航空航天大学,2002,21(3):22-24.
  • 3王文亭.钒与不锈钢钎焊及其钉缝脆相研究[J].焊接通汛,1981(4):24-28.
  • 4曲文卿,董峰,齐志刚,庄鸿寿,孟伟.异种材料的连接[J].航天制造技术,2006(3):44-49. 被引量:35
  • 5张洪涛,何鹏,孔庆伟,唐旭东,苏琳,杨国峰,孙静波.铝钢异种材料焊接研究现状与发展[J].焊接,2006(12):7-12. 被引量:32
  • 6吕学勤,杨尚磊,吴毅雄,石忠贤.铝合金与不锈钢的过渡层钎焊[J].焊接学报,2004,25(1):95-98. 被引量:38
  • 7FUKUMOTO S,TSUBAKINO H, OKITA K. Amorphization by friction welding between 5052 aluminum alloy and 304 stainless steel [ J ]. Scripta Materalia, 2010,42 ( 8 ) : 807 -812.
  • 8ATABAKI M M, IDRIS J. Low-temperature partial transient liq- uid phase diffusion bonding of AI/Mg2 Si metal malrix compos- ite to AZ91D using Al-based interlayer [ J]. Materials and Design, 2012,34 : 832-841.
  • 9SYEY A. Reliability and Au embrittlement of lead free solders for BGA applications [ J ]. Properties and Interfaces,2011 ( 17 ) : 143-147.
  • 10郭志刚.铝和铝合金镀镍及其前处理[J].电镀与涂饰,1995,14(2):22-24. 被引量:12

二级参考文献71

共引文献141

同被引文献5

引证文献1

二级引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部