含弱界面层合梁的压电阻抗分析及参数研究

Analysis on Electro-mechanical Impedance for a Laminated Beam with Imperfect Interfaces and Parameter Configuration

采用有限元软件ANSYS进行模拟分析,构建了含弱界面损伤的层合结构压电阻抗(EMI)模型.分析中选用线弹簧模型对主体结构层间弱界面损伤进行构造,并与其他学者的解析解以及实验结果进行了对比,验证了考虑层间滑移或脱粘效应对层合结构进行模拟分析的有效性和准确性.然后,基于该模型对含弱界面的微型组合钢梁进行损伤研究.研究结果表明,所建立的三维有限元压电阻抗模型能够清晰地检测到损伤的出现和发展.最后,讨论了粘结剂等其他参数对该有限元模型的影响.

The Electro-mechanical impedance（EMI） model is established by employing the finite element software ANSYS. Firstly, the linear spring law is utilized to describe the interfacial properties between the layers of the host structures. Comparison with the existing experimental and numerical results is made to reinforce the presented analysis, in which both the interfacial debonding and sliding effects are taken into account. Secondly, the proposed model is employed to indentify the interfacial damages for a laminated beam. The results show that the presented method can detect the appearance and development of the interfacial damages. Finally, the effects of various parameters on the EMI model are highlighted, which include the bonding layer between the piezoelectric patches and the host beam.