摘要
针对微系统技术和产品发展的需求,通过模拟仿真设计保证了BGA在0.5~20.0 GHz范围内具有良好的宽带射频信号传输性能,并通过样件实测验证单个BGA的传输损耗和驻波比可以控制在0.5 d B和2以内。该结果可以为功能集成微系统提供一种高密度宽带数模混合信号垂直传输解决方案,同时将改变微系统功能单元的集成和互联形态。
Focusing on the vertical interconnection requirement of microsystem technology and product, ensured that BGA had good transmission quality during the band of 0.5~20.0 GHz by simulation. The sample testing confirmed that a single BGA had the transmission loss less than 0.5 d B and VWSR less than 2. This result will supply a high density vertical transmission solution for both low frequency and wide-band RF signals, and it may change the integration and interconnection configuration for microsystems.
出处
《电子工艺技术》
2016年第2期71-73,93,共4页
Electronics Process Technology
关键词
BGA
宽带
射频
互联
BGA
wide-band
RF
interconnection
