工艺条件及镀液杂质对瓦特镍镀层内应力的影响

The Influence on the Watt Nickel Internal Stress by Process Conditions and Impurities in Plating Solution

为控制生产中瓦特镍镀层的内应力,利用条形阴极法测试了镀液的温度、pH及镀液中的杂质等对瓦特镍镀层内应力的影响。结果表明,镀镍液θ为50℃,pH为4.0时,镀层内应力最小;随着镀液中Cu^(2+)、Zn^(2+)金属杂质含量的增加,镀层内应力均增加;另外,在生产中为降低镀层的内应力,还需严格控制硫酸镍品质。

The effects of temperature,pH and impurities on the watt nickel internal stress were tested by the strip cathode method in order to control the internal stress of watt nickel films in production. The results showed that the plating internal stress was the smallest when watt nickel plating solution was at 50 ℃and pH = 4. 0. As the concentration of Cu^2＋ and Zn^2＋ increasing,the plating internal stress was all enhanced. In addition,the quality of nickel sulfate should be strictly controlled in order to reduce the plating internal stress in the production.