搪塑模具制备中电镀用环氧树脂芯模固化过程的流变动力学研究

Rheological Studies on Curing Kinetics of Epoxy Resins for Electroplating in Slush Mold Preparation

搪塑模具制备过程中电镀用环氧树脂芯模的固化过程对于搪塑模具的制备至关重要。今采用流变学的的方法,对电镀用环氧树脂芯模的固化过程进行了研究。环氧树脂芯模在固化过程中,双酚A型环氧树脂与多元胺固化剂进行交联反应,固化程度逐渐增大。固化程度先缓慢增加,然后迅速增加,最后缓慢增加接近最大值,芯模完全固化。同时,温度对固化速率影响也很大。温度越高,速率越大;温度越低,速率越小,完全固化所用时间也就越长,则树脂芯模可操作加工时间也就越长。研究建立了电镀用环氧树脂的固化反应动力学方程,得到温度与固化速率的关系,同时获得固化反应的活化能,结果表明电镀用环氧树脂的固化反应动力学符合Kamal自催化动力学模型。

The curing process of epoxy resins for electroplating is important for slush mold preparation. This process was studied using rheological methods in this study. The results show that bisphenol-A epoxy resins react with polyamine and the degree of curing increases with time. The degree of curing increases from being slowly to being fast and finally become slowly again to stabilized. Meanwhile, the temperature has an important effect on curing rates. As the reaction temperature increases, the curing rate of the two-component epoxy resin speeds up, while the curing rate declines as the reaction temperature decreases. Therefore, the time that can be used to handle the epoxy resin for making mold becomes longer. The curing kinetic equation for the epoxy resin is established, and the relationship between curing rate and reaction temperature is also obtained. The activation energy for the curing process is acquired. It is concluded that the curing kinetics of the epoxy resin follows the Kamal autocatalytic kinetic model.