摘要
采用回流焊接技术制备Au80Sn20/Cu焊点,研究其显微组织和剪切强度随回流焊接工艺参数之间的演变规律。结果表明:在焊接温度为310℃时,焊点界面处形成的(Au,Cu)5Sn金属间化合物(IMC)层随回流次数增加而增厚;IMC形貌由层状转变为扇贝状,最后成长为胞状;焊点剪切强度随回流次数增加而下降,回流1次后剪切强度为82.94 MPa,回流20次后下降至54.33 MPa;且回流焊接次数对焊点断口形貌和断裂方式造成影响:1次回流后在Cu/IMC界面发生韧性断裂;而3次和5次回流后断裂面分别出现在焊料中和IMC中,为韧性脆性混合断裂;回流次数超过10次后焊点发生脆性断裂。
The Au80Sn20/Cu solder joint was prepared by reflow soldering. The effect of reflow soldering cycles on the shear strength as well as microstructure of solder joint were investigated. The results show that as the reflow soldering cycles increase at 310 ℃, the thickness of the（Au,Cu）5Sn interfacial intermetallic compound（IMC） layers increases. The morphology changes from layered growth into a scalloped, and finally into cellular. The shear strength of the solder joint decreases with increasing the reflow cycles, and decreases from 82.94 MPa after one cycle to 54.33 MPa after twenty cycles. The fracture type is ductile in solder matrix after one cycle. After three and five reflow soldering cycles, the fracture surface is found partly in the bulk solder and partly on the IMC layer. The fracture type belongs to the mixed ductile and brittle manner. When the solder joints reflow more than ten cycles, the fracture is brittle.
出处
《粉末冶金材料科学与工程》
EI
北大核心
2016年第2期303-310,共8页
Materials Science and Engineering of Powder Metallurgy
基金
国家高技术研究发展规范(973计划)项目(2012AA03A704)
