摘要
文章从超声扫描检测技术的原理出发,详细叙述了不同模式的超声扫描对IGBT模块的无损检测功能。超声扫描检测技术不仅可发现IGBT模块中的空洞、脱附等界面潜在缺陷,还可以采用表面平整度分析、模块内部构造模拟、厚度测量等方法发现IGBT模块的结构缺陷,这些缺陷的表征对评估IGBT模块质量具有重要意义。
It introduced the principle of acoustic scanning microscope（SAM）, described the undamaged detection functions of SAM in IGBT modules with different modes. With this technology, it not only can discover interface defects（like hole and detachment） easily, but also can find structure defects by analysis of surface evenness, modulation of internal composition and thickness measurement, and the characterization of defects are very important to quality assessment in IGBT modules.
出处
《大功率变流技术》
2016年第2期30-34,共5页
HIGH POWER CONVERTER TECHNOLOGY
