超声对电子元件用低温钎焊合金组织与性能的影响

Effect of Ultrasonic Vibration Assisted Pouring on Microstructure and Properties of the Low Temperature Soldering Alloy for Electronic Components

分别采用常规浇注和超声振动辅助浇注制备了电子元件用低温钎焊Sn-58Bi合金,并对其进行了显微组织、微区成分、可焊性以及不同温度下力学性能的测试与分析。结果表明,超声振动辅助浇注法可以显著提高合金的力学性能和可焊性。与常规浇注相比,超声振动辅助浇注可使合金在-40℃、25℃和150℃时抗拉强度分别提高70%、72%、80%,并使润湿时间减少43%、最大润湿力增大36%。

Low temperature soldering alloy Sn-58 Bi for electronic components was prepared by conventional pouring and by ultrasonic vibration assisted pouring.And the microstructure,chemical composition in the micro zone,solderability and mechanical properties of the alloy at different temperature were tested and analyzed.The results show that ultrasonic vibration assisted pouring can improve significantly the mechanical properties and solderability of the alloy.Compared with conventional pouring,ultrasonic vibration assisted pouring can improve the tensile strength at-40 ℃、25 ℃ and 150 ℃ by 70%,72% and 80%,respectively.And it can also decrease the wetting（zero crossing）time by 43%,and increase the maximum wetting force by 36%.