点杂多晶太阳能硅片电解磨削多线切割试验研究

Experimental Study on Impurities Polycrystalline Solar Wafer by Hybrid Electrochemical Grinding Multi-wire Saw

提出了一种电解磨削多线切割点杂多晶太阳能硅片的新方法。电源的正极接硅锭,负极接切割线网,电解过程中硅锭发生微区钝化反应,形成硬度较小的钝化膜,使点杂多晶太阳能硅片更易切割。试验结果表明:该技术具有切割效率高、切片合格率高等优点。进一步检测发现,硅片宏观表面线痕浅、隐裂少,微观表面平整性好。该技术的应用降低了硅片加工的成本,提高了硅材料的利用率,也为太阳能电池的运用拓宽了空间。

A new technology of cutting impurities polycrystalline solar wafer by hybrid electrochemical grinding multi-wire saw is put forward. Silicon ingot and cutting wire are connected with pulse power anode and cathode respectively. Due to electrolysis,micro passivation reaction will happen and passivation film whose hardness is smaller than silicon will form in surface of silicon ingot,which makes impurities polycrystalline ingot easier to be cut. The experimental results show that higher efficiency of cutting and higher slicing passes rate can be obtained by introducing this technique.Further,it is found that saw marks of silicon wafer is more shallow,micro-cracks is fewer and microscopic surface flatness is better. The technique can reduce silicon cutting cost and increase utilization of silicon. Thereby,the space for the use of solar cells is broadened.