无铅锡钎料(Sn99.3Cu0.7)润湿性试验

The Wettability Test of Lead-free Tin Solder(Sn99.3Cu0.7)

针对无铅锡钎料润湿性的影响因素,通过对无铅锡钎料(Sn99.3Cu0.7)在同一钎焊时间不同钎焊温度下以及同一温度不同钎焊时间的润湿性的研究(试验温度在推荐的最佳钎焊温度范围内),得出温度和钎焊时间对无铅锡钎料(Sn99.3Cu0.7)的润湿性的影响趋势。研究结果表明:钎焊温度升高、钎焊时间延长,可不同程度提高润湿力。

Aiming at the factors of lead-free tin solder＇s wettability,this paper studies the wettability of leadfree tin solder （Sn99.3Cu0.7） under different brazing temperature and at the same brazing time and lead-free tin solder under same brazing temperature and at the different brazing time （the test temperature is within the recommended optimum brazing temperature range） so as to get impact trend of temperature and brazing time on lead-free tin solder＇s （Sn99.3Cu0.7） wettability. The research shows that the increase of brazing temperature and time can improve the wetting power at varying degrees.