摘要
Y98-61434-68 9913225互连技术的建模与特性:CA、芯片规模、球栅阵列(BGA),第2部分(含4篇文章)=Modeling and charac-terization of interconnect technologies:C4,chip-scale,BGA—partⅡ[会,英]//1998 IEEE 6th IntersocietyConference on Thermal and Thermomechanical Phenome-na in Electronic Systems.—68～95(AG)
出处
《电子科技文摘》
1999年第9期51-54,共4页
Sci.& Tech.Abstract
