摘要
Y2000-62028-277 0018178高功耗 LSI 芯片用的具有散热器的倒装片组件=Flip-chip package with a heat spreader for high dissipation LSIchips[会,英]/Ando,H.& Kikuchi,H.//1999 IEEE49th Electronic Components and Technology Confer-ence.—227～231(PC)Y2000-62028-430 0018179高性能 LSI 用的1000插头小节距球形栅阵列=Devel-opment of a 1000-pin fine-pitch BGA for high perfor-
出处
《电子科技文摘》
2000年第11期29-29,共1页
Sci.& Tech.Abstract
