摘要
Y2000-62135-167 0020146作为高导电率衬垫用于铜/苯环丁烯互连的掺碳铜=Carbon-doped copper as a high-conductivity liner for cop-per/Benzocyclobutene(BCB)interconnects[会,英]/Neirynck,J.M.& Xiao,Y.//1999 IEEE Proeeedingsof International Interconnect Technology Conference.-167～169(EC)
出处
《电子科技文摘》
2000年第12期40-41,共2页
Sci.& Tech.Abstract
