摘要
Y2000-62028-1056 0100379基于万维网的虚拟封装实验室开发的进展=Progresstowards developing a Web-based virtual packaging labora-tory[会,英]/Light,D.L.& Elshazly.D.//1999IEEE 49th Electronic Components and Technology,Con-ference.—1056～1059(PC)Y2000-62185-13 0100380铝合金(Al-Si-Cu)金属化中的硅沉淀问题=The Siprecipitation problem in Aluntinium Alloy(Al-Si-Cu)metallization[会,英]/Hua,Y.N.& Liu,E.Z.//1998 IEEE International Conference on SemiconductorElectronice.—13～16(EC)
出处
《电子科技文摘》
2001年第1期33-33,共1页
Sci.& Tech.Abstract
