摘要
Y2002-63392-121 0316687灌封材料射频特性测量=Measurement of RF proper-ties of glob top and under-encapsulant materials〔会,英〕/Li, L. & Cook, B.//2001 IEEE 10th Topical Meetingon Electrical Performance of Electronic Packaging.-121～124(E)Y2002.63497 03166882001年IEEE微电子学与光子学中的聚合物及粘接剂会议录=2001 IEEE conference on polymers and adhe-
出处
《电子科技文摘》
2003年第8期9-11,共3页
Sci.& Tech.Abstract
