高功率半导体激光器陶瓷封装散热性能研究

Thermal Performance of High-power Semiconductor Laser Packaged by Ceramic Submount

为实现半导体激光器单管的高功率输出,研究了使用氮化铝和碳化硅两种陶瓷材料制成的三明治型过渡热沉的散热性能。首先使用有限元分析方法计算,然后利用光谱法测量激光器的工作热阻。数值计算和实验测量结果均显示,碳化硅制成的过渡热沉所封装器件的工作热阻更低,散热效果更好。此外,实验进一步测试了器件的光电特性,结果表明碳化硅陶瓷制成的过渡热沉封装器件的电光转换效率更高、输出功率更大。915 nm附近单管器件在注入电流15 A时的输出功率为16.3 W,最高电光转换效率达到了68.3%。

In order to achieve higher output power of laser-diodes single emitter,thermal performance of sandwiched submounts based on aluminum nitride and silicon carbide was investigated. The thermal resistance of devices was first calculated by finite element method numerically,and then tested by spectral method experimentally. Both the stimulated results and the experimental data show that the thermal resistance of devices packaged by Si C submounts is less than the Al N submounts,which means better heat dissipation capability of Si C submounts. In addition,optical characteristics of the devices were further tested. It is showed that higher output power and higher electro-optical conversion efficiency are achieved by the devices packaged by the Si C-sandwiched submounts. The output power of single emitter achieves 16. 3 W at the injected current of 15 A around 915 nm. The peak electro-optical conversion efficiency reaches 68. 3%,leading the domestic level.