固化工艺参数对复合材料补片温度场的影响

Effect of Curing Process Parameters on Temperature Field of Composite Patch

基于热传导定律和固化动力学理论,建立了热固性树脂基复合材料固化过程的三维有限元模型,通过与文献实验结果的比较,验证了该模型具有较高的可靠性。采用该模型计算了AS4/3501层合板挖补修理固化过程的温度场和固化度场,并分析了固化温度及升温速率对补片中心点温度场和固化度场的影响。结果表明:在固化反应的起始阶段,固化温度和升温速率对补片温度和固化度的影响很小;随着固化反应的进行,固化温度和升温速率对补片温度和固化度的影响越来越大;在第二次升温阶段初期,固化温度对补片中心点温度的影响又逐渐缩小;在每次保温阶段末期,补片温度和固化度不再受升温速率的影响。

Based on the thermal conduct law and curing kinetics theory,a three- dimensional finite element model of thermosetting resin matrix composite was developed during the curing process,the reliability of the developed model is verified by comparing with the experimental results in literature. Based on the model,temperature and curing degree fields of the scarf repaired AS4/3501 composite laminate were calculated during the curing process,effect of curing temperature and heating rate on temperature and curing degree fields of the patch is analyzed. The results indicate that the effect is very small during the initial stage of curing reaction; the effect increase with the curing time;however,the effect decrease with curing time during the initial stage of the second heating stage; the temperature and curing degree of composite patch do not change with heating rate during the final stage of constant temperature period.