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SnAgCu系软钎料钎焊接头性能研究 被引量:3

Study on joint properties of SnAgCu solder alloy
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摘要 制备了不同Ni含量的Sn2.5Ag0.7Cu0.1RE-x Ni钎料合金,对其显微组织、熔化特性和力学性能进行测试;使用该钎料对纯铜进行钎焊,然后对不同Ni含量的钎料合金钎焊接头的蠕变性能进行测试分析。结果表明:Ni的加入有利于提高钎料合金的力学性能和细化组织,但对于合金的熔化特性影响不大。在本次试验条件下,当w(Ni)分别为0.05%和1%时,接头试样的蠕变性能优于其他Ni含量的情况。 Sn2.5Ag0.7Cu0.1RE-x Ni solder alloy of different Ni content was prepared. After testing the microstructure,melting and mechanical property of the solder alloy, the copper was soldered, and then the creep properties of the soldered joints of different Ni content was tested and analyzed. The results showed that the addition of Ni was beneficial to the improvement of the mechanical property and refining microstructure of the solder alloy, but it had little effect on the melting property; under the conditions of this experiment, when the Ni content was 0.05% and1%, the creep property of the joints were better than that of the other Ni contents.
出处 《焊接技术》 2016年第4期5-7,105,共3页 Welding Technology
基金 河南科技大学大学生研究训练计划(SRTP)项目资助(2014035)
关键词 SNAGCU Ni含量 熔化特性 力学性能 蠕变性能 SnAgCu Ni content melting property mechanical property creep property
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