45°准同轴微波多层过孔TDR仿真技术

Simulation of 45° Quasi-coaxial Microwave Multilayer via Using TDR Technique

准同轴微波多层过孔是微波多层印制技术中常用的跨层互连形式,当互连结构较为复杂时,其微波性能会对系统指标构成较大影响,目前研究微波过孔的手段还主要局限于理论推导和频域仿真。首次使用TDR仿真技术,对45°准同轴微波多层过孔进行了建模、仿真和分析,并对过孔尺寸进行了优化,所得到的微波多层过孔结构具有较理想的50Ω阻抗特性,同时在很宽的频带内展现出良好的微波特性,进而验证了TDR仿真方法在分析准同轴微波多层过孔结构上的有效性。

Quasi-coaxial structure is one of the frequently used connecting methods in microwave multilayer printed circuits,but its character may bring significant effects on system specifications when complex connections are employed.Study methods of quasi-coax- ial structure are limited to theoretical derivation and frequency-domain simulations at present. In the paper, modeling, simulation and analysis of 45°quasi-coaxial microwave multilayer via are made employing TDR simulation method,while dimensions of the via are also optimized.The structure obtains 50 Ω impedance characteristic and good microwave performance in wide frequency band,which verify the effectiveness of TDR simulation method when used for analysis of quasi-coaxial microwave muhilayer via.