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Evaporation Erosion During the Relay Contact Breaking Process Based on a Simplified Arc Model 被引量:3

Evaporation Erosion During the Relay Contact Breaking Process Based on a Simplified Arc Model
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摘要 Evaporation erosion of the contacts is one of the fundamental failure mechanisms for relays. In this paper, the evaporation erosion characteristics are investigated for the copper contact pair breaking a resistive direct current (dc) 30 V/10 A circuit in the air. Molten pool simulation of the contacts is coupled with the gas dynamics to calculate the evaporation rate. A simplified arc model is constructed to obtain the contact voltage and current variations with time for the prediction of the current density and the heat flux distributions flowing from the arc into the contacts. The evaporation rate and mass variations with time during the breaking process are presented. Experiments are carried out to verify the simulation results. Evaporation erosion of the contacts is one of the fundamental failure mechanisms for relays. In this paper, the evaporation erosion characteristics are investigated for the copper contact pair breaking a resistive direct current (dc) 30 V/10 A circuit in the air. Molten pool simulation of the contacts is coupled with the gas dynamics to calculate the evaporation rate. A simplified arc model is constructed to obtain the contact voltage and current variations with time for the prediction of the current density and the heat flux distributions flowing from the arc into the contacts. The evaporation rate and mass variations with time during the breaking process are presented. Experiments are carried out to verify the simulation results.
出处 《Plasma Science and Technology》 SCIE EI CAS CSCD 2016年第5期512-519,共8页 等离子体科学和技术(英文版)
基金 supported by National Natural Science Foundation of China(Nos.51377038,51307030)
关键词 evaporation erosion material transfer molten pool simplified arc model evaporation erosion, material transfer, molten pool, simplified arc model
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  • 1Lu F G, Tang X H. 2006, Computational Materials Science, 35: 458.
  • 2Rong M Z, Ma Q, Wu Y, et al. 2009, J. Appl. Phys., 106: 023308.
  • 3Tepper J, Seeger M, Votteler T, et al. 2006, IEEE Trans. CPMT, 29: 658.
  • 4Yang F, Rong M Z, Wu Y, et al. 2010, J. Phys. D: Appl. Phys., 43: 434011.
  • 5Yang F, Wu Y, Rong M Z, et al. 2013, J. Phys. D: Appl. Phys., 46: 273001.
  • 6Sarrailh P, Garrigues L, Hagelaar G J M, et al. 2009, J. Appl. Phys., 106: 053305.
  • 7Long N P, Takana Y, Uesugi Y. 2012, IEEE Trans. Plasma Sci., 40: 497.
  • 8Wang L J, Zhou X, Wang H J, et al. 2012, IEEE Trans. Plasma Sci., 40: 2237.
  • 9Lowke J J, Morrow R, Haidar J. 1997, J. Phys. D: Appl. Phys., 30: 2033.
  • 10Cayla F, Freton P, Gonzalez J J. 2008, IEEE Trans. Plasma Sci., 36: 1944.

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