摘要
采用了三因素、三水平的正交试验法对合金结构钢脉冲防渗镀铜工艺进行了工艺参数的优选,得到较优的工艺条件。对镀铜层的微观形貌及孔隙率、防渗碳效果等性能进行了研究。结果表明,采用脉冲电镀的方法制备的防渗镀铜层结晶细致、结合力良好、孔隙率较低。镀覆20μm的铜层可以有效改善渗碳的效果。
The technological parameters of anti-permeation pulse copper-plating on alloy constructional steel were optimized by orthogonal test in three facts and three levels, and the optimal technological parameters were obtained. Surface morphology, porosity and anti-carburizing effect of the copper coating were investigated. The results showed that the copper coating prepared by pulse plating possessed dense crystal morphology, good adhesion and low porosity. The effect of carburizing could be improved effectively when the thickness of the copper coating was about 20 μm.
出处
《电镀与精饰》
CAS
北大核心
2016年第5期37-40,共4页
Plating & Finishing
关键词
脉冲电镀
防渗镀铜
孔隙率
pulse plating
anti-permeation copper-plating
porosity
