厚膜电阻制造技术研究

Researoh of the Thick-film Resistor Printing Technology Innovation

针对传统厚膜混合集成电路在厚膜电阻制造过程中存在厚膜电阻阻值离散性大、印刷效率低及产生大量试阻片浪费等问题,特对厚膜制造技术进行了研究。通过对厚膜电阻设计和制造原理进行分析,发现厚膜电阻印刷膜厚对其阻值至关重要,因此,决定采用厚膜电阻印刷膜厚监测以达到控制厚膜电阻阻值的方式,先对厚膜电阻印刷时膜厚控制范围进行确定,同时根据所使用的厚膜电阻浆料方阻的不同,对厚膜电阻印刷膜厚控制范围进行调整,然后依据调整后的膜厚控制范围直接进行厚膜电阻印刷。经过实际验证,采用这种加工方式使厚膜电阻加工效率和成品率得到了大大提高,同时厚膜电阻阻值一致性也得到了很大改善。

Aimed at problems like excessively larger distribution of resistance discrete characteristic, low-efficiency in thick-film resistor printing and large amount of material wasting in resistance-testing, the relevant thick-film production technical research has been carried out. Through the analysis of resistance designing and production principles, it has been found that the thick-film resistor printing thickness has a vital impact on its resistance value, then apply the thick-film resistor printing thickness in monitoring the printing process, and the relevant resistance values could be well controlled. Firstly, define the thick-film resistor printing thickness range. Secondly, adjust the resistor printing thickness range by various square resistances. Finally, the actuaI thick-film resistor printing work is directly referred to the after-adjustment resistor printing thickness range. Through the practical validation experiments, the thick-film resistor printing efficiency and production yields are improved, and the working consistency is elevated.